 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| d a t a sh eet product speci?cation file under integrated circuits, ic12 1999 aug 05 integrated circuits PCF8575C remote 16-bit i/o expander for i 2 c-bus
1999 aug 05 2 philips semiconductors product speci?cation remote 16-bit i/o expander for i 2 c-bus PCF8575C contents 1 features 2 general description 3 ordering information 4 block diagram 5 pinning 6 functional description 6.1 quasi-bidirectional i/os 6.2 addressing 6.3 reading from a port (input mode) 6.4 writing to the port (output mode) 6.5 interrupt 7 characteristics of the i 2 c-bus 7.1 bit transfer 7.2 start and stop conditions 7.3 system configuration 7.4 acknowledge 8 limiting values 9 handling 10 characteristics 11 i 2 c-bus timing characteristics 12 device protection 13 package outline 14 soldering 14.1 introduction to soldering surface mount packages 14.2 reflow soldering 14.3 wave soldering 14.4 manual soldering 14.5 suitability of surface mount ic packages for wave and reflow soldering methods 15 definitions 16 life support applications 17 purchase of philips i 2 c components 1999 aug 05 3 philips semiconductors product speci?cation remote 16-bit i/o expander for i 2 c-bus PCF8575C 1 features operating supply voltage from 4.5 to 5.5 v low standby current consumption of 10 m a maximum i 2 c-bus to parallel port expander 400 kbits/s fast i 2 c-bus open-drain interrupt output 16-bit remote i/o port for the i 2 c-bus compatible with most microcontrollers latched outputs with high current drive capability for directly driving leds address by 3 hardware address pins for use of up to 8 devices ssop24 package. 2 general description the device is a silicon cmos circuit. it provides general purpose remote i/o expansion for most microcontroller families via the two-line bidirectional bus (i 2 c-bus). the device consists of a 16-bit quasi-bidirectional port and an i 2 c-bus interface. the PCF8575C has a low current consumption and includes latched outputs with high current drive capability for directly driving leds. it also possesses an interrupt line ( int) which can be connected to the interrupt logic of the microcontroller. by sending an interrupt signal on this line, the remote i/o can inform the microcontroller if there is incoming data on its ports without having to communicate via the i 2 c-bus. this means that the device is an i 2 c-bus slave transmitter/receiver. every data transmission from the PCF8575C must consist of an even number of bytes, the first byte will be referred to as p07 to p00 and the second byte as p17 to p10. the third will be referred to as p07 to p00 and so on. 3 ordering information type number package name description version PCF8575Cts ssop24 plastic shrink small outline package; 24 leads; body width 5.3 mm sot340-1 1999 aug 05 4 philips semiconductors product speci?cation remote 16-bit i/o expander for i 2 c-bus PCF8575C 4 block diagram handbook, full pagewidth mgs630 i 2 c-bus control input filter 1 2 3 22 23 21 interrupt logic 16 bits p00 to p07 4 to 11 p10 to p17 13 to 20 i/o port shift register lp filter write pulse read pulse power-on reset 24 12 v dd v ss sda scl a2 a1 a0 int PCF8575C fig.1 block diagram. 1999 aug 05 5 philips semiconductors product speci?cation remote 16-bit i/o expander for i 2 c-bus PCF8575C 5 pinning symbol pin description int 1 interrupt output (active low) a1 2 address input 1 a2 3 address input 2 p00 4 quasi-bidirectional i/o 00 p01 5 quasi-bidirectional i/o 01 p02 6 quasi-bidirectional i/o 02 p03 7 quasi-bidirectional i/o 03 p04 8 quasi-bidirectional i/o 04 p05 9 quasi-bidirectional i/o 05 p06 10 quasi-bidirectional i/o 06 p07 11 quasi-bidirectional i/o 07 v ss 12 supply ground p10 13 quasi-bidirectional i/o 10 p11 14 quasi-bidirectional i/o 11 p12 15 quasi-bidirectional i/o 12 p13 16 quasi-bidirectional i/o 13 p14 17 quasi-bidirectional i/o 14 p15 18 quasi-bidirectional i/o 15 p16 19 quasi-bidirectional i/o 16 p17 20 quasi-bidirectional i/o 17 a0 21 address input 0 scl 22 serial clock line input sda 23 serial data line input/output v dd 24 supply voltage handbook, halfpage PCF8575C mgs631 1 2 3 4 5 6 7 8 9 10 11 12 int a1 a2 p00 p01 p02 p03 p04 p05 p06 p07 v ss v dd sda scl a0 p17 p16 p15 p14 p13 p12 p11 p10 24 23 22 21 20 19 18 17 16 15 14 13 fig.2 pin configuration. 1999 aug 05 6 philips semiconductors product speci?cation remote 16-bit i/o expander for i 2 c-bus PCF8575C 6 functional description 6.1 quasi-bidirectional i/os the 16 ports (see fig.3) are entirely independent and can be used either as input or output ports. input data is transferred from the ports to the microcontroller in the read mode (see fig.6). output data is transmitted to the ports in the write mode (see fig.5). this quasi-bidirectional i/o can be used as an input or output without the use of a control signal for data direction. at power-on all the i/os are in 3-state mode. the strong pull-up to v dd (i oht ) allows a fast rising edge into a heavily loaded output. this strong pull-up turns on when the output is written high, and is switched off by the negative edge of scl. after this short period the output is in 3-state mode. the i/o should be written high before being used as an input. after power-on as all the i/os are set to 3-state all of them can be used as inputs. any change in setting of the i/os as either inputs or outputs can be done with the write mode. warning: if a high is applied to an i/o which has been written earlier to low, a large current (i ol ) will flow to v ss (see chapter 10; note 3). 6.2 addressing figures 4, 5 and 6 show the address and timing diagrams. before any data is transmitted or received the master must send the address of the receiver via the sda line. the first byte transmitted after the start condition carries the address of the slave device and the read/write bit. the address of the slave device must not be changed between the start and the stop conditions. the PCF8575C acts as a slave receiver or a slave transmitter. handbook, full pagewidth mgs632 dq c i c i s ff d i ol i oht q s ff to interrupt logic v ss v dd p00 to p07 p10 to 17 write pulse data from shift register power-on reset read pulse data to shift register fig.3 simplified schematic diagram of each i/o. mgl541 handbook, halfpage s 0 1 0 0 a2 a1 a0 r/w a slave address fig.4 byte containing the slave address and the r/ w bits. 1999 aug 05 7 philips semiconductors product speci?cation remote 16-bit i/o expander for i 2 c-bus PCF8575C this text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader .this text is here in _ white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader.this text is here inthis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader. white to force landscape pages to be ... n dbook, full pagewidth mgs633 s 0 1 0 0 a2 a1 a0 0 a p07 p06 p00 p17 p10 1 start condition r/w p05 acknowledge from slave a a sda scl integral multiples of two bytes write to port t pv i oht data output from port 05 output voltage 05 pull-up output current int slave address (PCF8575C) data to port 0 data to port 1 12345678 acknowledge from slave acknowledge from slave t ir data a0 and b0 valid fig.5 write mode (output). 1999 aug 05 8 philips semiconductors product speci?cation remote 16-bit i/o expander for i 2 c-bus PCF8575C this text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader .this text is here in _ white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader.this text is here inthis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader. white to force landscape pages to be ... b ook, full pagewidth mgl543 s 0 1 0 0 a2 a1 a0 1 a p07 p06 p05 p04 p07 to p00 p17 to p10 p07 to p00 p17 to p10 p07 to p00 p17 to p10 p03 p02 p01 p00 p17 p10 r/w acknowledge from slave a a p07 p00 a p17 p10 1p sda scl read from port t h data into port int acknowledge from receiver acknowledge from receiver acknowledge from receiver non acknowledge from receiver t su t ir t ir t iv fig.6 read mode (input). a low-to-high transition of sda, while scl is high is defined as the stop condition (p). transfer of data can be stopped at any moment by a stop condition. when this occurs, data present at the latest acknowledge phase is valid (output mode). input data is lost. 1999 aug 05 9 philips semiconductors product speci?cation remote 16-bit i/o expander for i 2 c-bus PCF8575C 6.3 reading from a port (input mode) all ports programmed as input should be set to logic 1. to read, the master (microcontroller) first addresses the slave device after it receives the interrupt. by setting the last bit of the byte containing the slave address to logic 1 the read mode is entered. the data bytes that follow on the sda are the values on the ports. if the data on the input port changes faster than the master can read, this data may be lost. 6.4 writing to the port (output mode) to write, the master (microcontroller) first addresses the slave device. by setting the last bit of the byte containing the slave address to logic 0 the write mode is entered. the PCF8575C acknowledges and the master sends the first data byte for p07 to p00. after the first data byte is acknowledged by the PCF8575C, the second data byte p17 to p10 is sent by the master. once again the PCF8575C acknowledges the receipt of the data after which this 16-bit data is presented on the port lines. the number of data bytes that can be sent successively is not limited. after every two bytes the previous data is overwritten. the first data byte in every pair refers to port 0 (p07 to p00), whereas the second data byte in every pair refers to port 1 (p17 to p10), see fig.7. 6.5 interrupt the PCF8575C provides an open-drain interrupt ( int) which can be fed to a corresponding input of the microcontroller (see figs 5, 6 and 8). this gives these chips a kind of a master function which can initiate an action elsewhere in the system. an interrupt is generated by any rising or falling edge of the port inputs. after time t iv the signal int is valid. the interrupt disappears when data on the port is changed to the original setting or data is read from or written to the device which has generated the interrupt. in the write mode the interrupt may become deactivated (high) on the rising edge of the write to port pulse. on the falling edge of the write to port pulse the interrupt is definitely deactivated (high). the interrupt is reset in the read mode on the rising edge of the read from port pulse. during the resetting of the interrupt itself any changes on the i/os may not generate an interrupt. after the interrupt is reset any change in i/os will be detected and transmitted as an int. handbook, full pagewidth mgl545 07 06 05 04 03 02 01 00 p07 p06 p05 p04 p03 p02 p01 p00 a first byte 17 16 15 14 13 12 11 10 p17 p16 p15 p14 p13 p12 p11 p10 a second byte fig.7 correlation between bits and ports. 1999 aug 05 10 philips semiconductors product speci?cation remote 16-bit i/o expander for i 2 c-bus PCF8575C handbook, full pagewidth mgs634 microcomputer int int int PCF8575C (1) PCF8575C (2) v dd int PCF8575C (8) fig.8 application of multiple PCF8575Cs with interrupt. 1999 aug 05 11 philips semiconductors product speci?cation remote 16-bit i/o expander for i 2 c-bus PCF8575C 7 characteristics of the i 2 c-bus the i 2 c-bus is for bidirectional, 2-line communication between different ics or modules. the two lines are a serial data line (sda) and a serial clock line (scl). both lines must be connected to a positive supply via a pull-up resistor when connected to the output stages of a device. data transfer may be initiated only when the bus is not busy. 7.1 bit transfer one data bit is transferred during each clock pulse. the data on the sda line must remain stable during the high period of the clock pulse as changes in the data line at this time will be interpreted as control signals (see fig.9). 7.2 start and stop conditions both data and clock lines remain high when the bus is not busy. a high-to-low transition of the data line, while the clock is high is defined as the start condition (s). a low-to-high transition of the data line while the clock is high is defined as the stop condition p (see fig.10). 7.3 system con?guration a device generating a message is a transmitter, a device receiving the message is the receiver. the device that controls the message is the master and the devices which are controlled by the master are the slaves (see fig.11). 7.4 acknowledge the number of data bytes transferred between the start and the stop conditions from transmitter to receiver is not limited. each byte of eight bits is followed by one acknowledge bit. the transmitter must release the sda line before the receiver can send an acknowledge bit. a slave receiver which is addressed must generate an acknowledge after the reception of each byte. also a master must generate an acknowledge after the reception of each byte that has been clocked out of the slave transmitter. the device that acknowledges has to pull down the sda line during the acknowledge clock pulse, so that the sda line is stable low during the high period of the acknowledge related clock pulse, set-up and hold times must be taken into account. a master receiver must signal an end of data to the transmitter by not generating an acknowledge after the last byte that has been clocked out of the slave. this is done by the master receiver by holding the sda line high. in this event the transmitter must release the data line to enable the master to generate a stop condition. handbook, full pagewidth mbc621 data line stable; data valid change of data allowed sda scl fig.9 bit transfer. 1999 aug 05 12 philips semiconductors product speci?cation remote 16-bit i/o expander for i 2 c-bus PCF8575C handbook, full pagewidth mbc622 sda scl p stop condition sda scl s start condition fig.10 definition of start and stop conditions. mba605 master transmitter / receiver slave receiver slave transmitter / receiver master transmitter master transmitter / receiver sda scl fig.11 system configuration. handbook, full pagewidth mgl539 s start condition 9 8 2 1 clock pulse for acknowledgement not acknowledge data output by transmitter data output by receiver scl from master acknowledge fig.12 acknowledgment on the i 2 c-bus. 1999 aug 05 13 philips semiconductors product speci?cation remote 16-bit i/o expander for i 2 c-bus PCF8575C 8 limiting values in accordance with the absolute maximum rating system (iec 134); note 1. note 1. stress above those listed under absolute maximum ratings may cause permanent damage to the device. this is a stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. 9 handling inputs and outputs are protected against electrostatic discharge in normal handling. however, to be totally safe, it is desirable to take precautions appropriate to handling mos devices. advice can be found in data handbook ic12 under handling mos devices . 10 characteristics v dd = 4.5 to 5.5 v; v ss =0v; t amb = - 40 to +85 c; unless otherwise speci?ed. symbol parameter min. max. unit v dd supply voltage - 0.5 +6.5 v i dd supply current - 100 ma i ss supply current - 100 ma v i input voltage v ss - 0.5 v dd + 0.5 v i i dc input current - 20 ma i o dc output current - 25 ma p tot total power dissipation - 400 mw p o power dissipation per output - 100 mw t stg storage temperature - 65 +150 c t amb ambient temperature - 40 +85 c symbol parameter conditions min. typ. max. unit supplies v dd supply voltage 4.5 - 5.5 v i dd supply current operating mode; no load; v i =v dd or v ss ; f scl = 400 khz - 100 200 m a i dd(stb) standby current standby mode; no load; v i =v dd or v ss - 2.5 10 m a v por power-on reset voltage note 1 - 1.2 1.8 v v il1 low-level input voltage pins a0, a1, a2, sda and scl - 0.8 - 0.3v dd v v il2 low-level input voltage pins p00 to p17 - 0.8 - 0.6v dd v v ih1 high-level input voltage pins a0, a1, a2, sda and scl 0.7v dd - v dd + 0.8 v v ih2 high-level input voltage pins p00 to p17 0.8v dd - v dd + 0.8 v 1999 aug 05 14 philips semiconductors product speci?cation remote 16-bit i/o expander for i 2 c-bus PCF8575C notes 1. the power-on reset circuit resets the i 2 c-bus logic with v dd 1999 aug 05 16 philips semiconductors product speci?cation remote 16-bit i/o expander for i 2 c-bus PCF8575C 12 device protection handbook, full pagewidth mgs635 1 2 3 4 5 6 7 8 9 10 11 12 15 16 17 18 19 20 21 22 23 24 14 13 p12 p13 p14 p15 p16 p17 a0 scl sda v dd p11 p10 int a1 a2 p00 p01 p02 p03 p04 p05 p06 p07 v ss substrate v ss v dd fig.14 device protection diagram. 1999 aug 05 17 philips semiconductors product speci?cation remote 16-bit i/o expander for i 2 c-bus PCF8575C 13 package outline unit a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p qz y w v q references outline version european projection issue date iec jedec eiaj mm 0.21 0.05 1.80 1.65 0.38 0.25 0.20 0.09 8.4 8.0 5.4 5.2 0.65 1.25 7.9 7.6 0.9 0.7 0.8 0.4 8 0 o o 0.13 0.1 0.2 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.20 mm maximum per side are not included. 1.03 0.63 sot340-1 mo-150ag 93-09-08 95-02-04 x w m q a a 1 a 2 b p d h e l p q detail x e z e c l v m a (a ) 3 a 112 24 13 0.25 y pin 1 index 0 2.5 5 mm scale ssop24: plastic shrink small outline package; 24 leads; body width 5.3 mm sot340-1 a max. 2.0 1999 aug 05 18 philips semiconductors product speci?cation remote 16-bit i/o expander for i 2 c-bus PCF8575C 14 soldering 14.1 introduction to soldering surface mount packages this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our data handbook ic26; integrated circuit packages (document order number 9398 652 90011). there is no soldering method that is ideal for all surface mount ic packages. wave soldering is not always suitable for surface mount ics, or for printed-circuit boards with high population densities. in these situations reflow soldering is often used. 14.2 re?ow soldering reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. typical reflow peak temperatures range from 215 to 250 c. the top-surface temperature of the packages should preferable be kept below 230 c. 14.3 wave soldering conventional single wave soldering is not recommended for surface mount devices (smds) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. to overcome these problems the double-wave soldering method was specifically developed. if wave soldering is used the following conditions must be observed for optimal results: use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. for packages with leads on two sides and a pitch (e): C larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; C smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves at the downstream end. for packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves downstream and at the side corners. during placement and before soldering, the package must be fixed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. typical dwell time is 4 seconds at 250 c. a mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 14.4 manual soldering fix the component by first soldering two diagonally-opposite end leads. use a low voltage (24 v or less) soldering iron applied to the flat part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 c. 1999 aug 05 19 philips semiconductors product speci?cation remote 16-bit i/o expander for i 2 c-bus PCF8575C 14.5 suitability of surface mount ic packages for wave and re?ow soldering methods notes 1. all surface mount (smd) packages are moisture sensitive. depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). for details, refer to the drypack information in the data handbook ic26; integrated circuit packages; section: packing methods . 2. these packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. if wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. the package footprint must incorporate solder thieves downstream and at the side corners. 4. wave soldering is only suitable for lqfp, tqfp and qfp packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. wave soldering is only suitable for ssop and tssop packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. package soldering method wave reflow (1) bga, sqfp not suitable suitable hlqfp, hsqfp, hsop, htqfp, htssop, sms not suitable (2) suitable plcc (3) , so, soj suitable suitable lqfp, qfp, tqfp not recommended (3)(4) suitable ssop, tssop, vso not recommended (5) suitable 1999 aug 05 20 philips semiconductors product speci?cation remote 16-bit i/o expander for i 2 c-bus PCF8575C 15 definitions 16 life support applications these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips for any damages resulting from such improper use or sale. 17 purchase of philips i 2 c components data sheet status objective speci?cation this data sheet contains target or goal speci?cations for product development. preliminary speci?cation this data sheet contains preliminary data; supplementary data may be published later. product speci?cation this data sheet contains ?nal product speci?cations. limiting values limiting values given are in accordance with the absolute maximum rating system (iec 134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information where application information is given, it is advisory and does not form part of the speci?cation. purchase of philips i 2 c components conveys a license under the philips i 2 c patent to use the components in the i 2 c system provided the system conforms to the i 2 c specification defined by philips. this specification can be ordered using the code 9398 393 40011. 1999 aug 05 21 philips semiconductors product speci?cation remote 16-bit i/o expander for i 2 c-bus PCF8575C notes 1999 aug 05 22 philips semiconductors product speci?cation remote 16-bit i/o expander for i 2 c-bus PCF8575C notes 1999 aug 05 23 philips semiconductors product speci?cation remote 16-bit i/o expander for i 2 c-bus PCF8575C notes ? philips electronics n.v. sca all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owne r. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not con vey nor imply any license under patent- or other industrial or intellectual property rights. internet: http://www.semiconductors.philips.com 1999 67 philips semiconductors C a worldwide company for all other countries apply to: philips semiconductors, international marketing & sales communications, building be-p, p.o. box 218, 5600 md eindhoven, the netherlands, fax. +31 40 27 24825 argentina: see south america australia: 3 figtree drive, homebush, nsw 2140, tel. +61 2 9704 8141, fax. +61 2 9704 8139 austria: computerstr. 6, a-1101 wien, p.o. box 213, tel. +43 1 60 101 1248, fax. +43 1 60 101 1210 belarus: hotel minsk business center, bld. 3, r. 1211, volodarski str. 6, 220050 minsk, tel. +375 172 20 0733, fax. +375 172 20 0773 belgium: see the netherlands brazil: see south america bulgaria: philips bulgaria ltd., energoproject, 15th floor, 51 james bourchier blvd., 1407 sofia, tel. +359 2 68 9211, fax. +359 2 68 9102 canada: philips semiconductors/components, tel. +1 800 234 7381, fax. +1 800 943 0087 china/hong kong: 501 hong kong industrial technology centre, 72 tat chee avenue, kowloon tong, hong kong, tel. +852 2319 7888, fax. +852 2319 7700 colombia: see south america czech republic: see austria denmark: sydhavnsgade 23, 1780 copenhagen v, tel. +45 33 29 3333, fax. +45 33 29 3905 finland: sinikalliontie 3, fin-02630 espoo, tel. +358 9 615 800, fax. +358 9 6158 0920 france: 51 rue carnot, bp317, 92156 suresnes cedex, tel. +33 1 4099 6161, fax. +33 1 4099 6427 germany: hammerbrookstra?e 69, d-20097 hamburg, tel. +49 40 2353 60, fax. +49 40 2353 6300 hungary: see austria india: philips india ltd, band box building, 2nd floor, 254-d, dr. annie besant road, worli, mumbai 400 025, tel. +91 22 493 8541, fax. +91 22 493 0966 indonesia: pt philips development corporation, semiconductors division, gedung philips, jl. buncit raya kav.99-100, jakarta 12510, tel. +62 21 794 0040 ext. 2501, fax. +62 21 794 0080 ireland: newstead, clonskeagh, dublin 14, tel. +353 1 7640 000, fax. +353 1 7640 200 israel: rapac electronics, 7 kehilat saloniki st, po box 18053, tel aviv 61180, tel. +972 3 645 0444, fax. +972 3 649 1007 italy: philips semiconductors, via casati, 23 - 20052 monza (mi), tel. +39 039 203 6838, fax +39 039 203 6800 japan: philips bldg 13-37, kohnan 2-chome, minato-ku, tokyo 108-8507, tel. +81 3 3740 5130, fax. +81 3 3740 5057 korea: philips house, 260-199 itaewon-dong, yongsan-ku, seoul, tel. +82 2 709 1412, fax. +82 2 709 1415 malaysia: no. 76 jalan universiti, 46200 petaling jaya, selangor, tel. +60 3 750 5214, fax. +60 3 757 4880 mexico: 5900 gateway east, suite 200, el paso, texas 79905, tel. +9-5 800 234 7381, fax +9-5 800 943 0087 middle east: see italy netherlands: postbus 90050, 5600 pb eindhoven, bldg. vb, tel. +31 40 27 82785, fax. +31 40 27 88399 new zealand: 2 wagener place, c.p.o. box 1041, auckland, tel. +64 9 849 4160, fax. +64 9 849 7811 norway: box 1, manglerud 0612, oslo, tel. +47 22 74 8000, fax. +47 22 74 8341 pakistan: see singapore philippines: philips semiconductors philippines inc., 106 valero st. salcedo village, p.o. box 2108 mcc, makati, metro manila, tel. +63 2 816 6380, fax. +63 2 817 3474 poland: ul. lukiska 10, pl 04-123 warszawa, tel. +48 22 612 2831, fax. +48 22 612 2327 portugal: see spain romania: see italy russia: philips russia, ul. usatcheva 35a, 119048 moscow, tel. +7 095 755 6918, fax. +7 095 755 6919 singapore: lorong 1, toa payoh, singapore 319762, tel. +65 350 2538, fax. +65 251 6500 slovakia: see austria slovenia: see italy south africa: s.a. philips pty ltd., 195-215 main road martindale, 2092 johannesburg, p.o. box 58088 newville 2114, tel. +27 11 471 5401, fax. +27 11 471 5398 south america: al. vicente pinzon, 173, 6th floor, 04547-130 s?o paulo, sp, brazil, tel. +55 11 821 2333, fax. +55 11 821 2382 spain: balmes 22, 08007 barcelona, tel. +34 93 301 6312, fax. +34 93 301 4107 sweden: kottbygatan 7, akalla, s-16485 stockholm, tel. +46 8 5985 2000, fax. +46 8 5985 2745 switzerland: allmendstrasse 140, ch-8027 zrich, tel. +41 1 488 2741 fax. +41 1 488 3263 taiwan: philips semiconductors, 6f, no. 96, chien kuo n. rd., sec. 1, taipei, taiwan tel. +886 2 2134 2886, fax. +886 2 2134 2874 thailand: philips electronics (thailand) ltd., 209/2 sanpavuth-bangna road prakanong, bangkok 10260, tel. +66 2 745 4090, fax. +66 2 398 0793 turkey: yukari dudullu, org. san. blg., 2.cad. nr. 28 81260 umraniye, istanbul, tel. +90 216 522 1500, fax. +90 216 522 1813 ukraine : philips ukraine, 4 patrice lumumba str., building b, floor 7, 252042 kiev, tel. +380 44 264 2776, fax. +380 44 268 0461 united kingdom: philips semiconductors ltd., 276 bath road, hayes, middlesex ub3 5bx, tel. +44 208 730 5000, fax. +44 208 754 8421 united states: 811 east arques avenue, sunnyvale, ca 94088-3409, tel. +1 800 234 7381, fax. +1 800 943 0087 uruguay: see south america vietnam: see singapore yugoslavia: philips, trg n. pasica 5/v, 11000 beograd, tel. +381 11 62 5344, fax.+381 11 63 5777 printed in the netherlands 465006/01/pp 24 date of release: 1999 aug 05 document order number: 9397 750 06117 |
Price & Availability of PCF8575C
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |